Ball Grid Array Production

With nearly 40 years of experience in electronic manufacturing, Hi-Tek specializes in delivering high-quality surface mount packaging solutions like BGA for complex, high-speed builds. Whether you’re working on a prototype, a high-mix project, or ready to scale into full-volume production, we offer the technical expertise, flexibility, and customer-first service to bring your project to life.

A ball grid array (BGA) is a type of surface mount package that allows an integrated circuit to be mounted directly onto a printed circuit board (PCB) using an array of solder balls instead of traditional leads. Unlike pin grid arrays (PGA), which use long pins inserted into board holes, BGA relies on small solder balls arranged underneath the chip.

During the assembly process, the BGA is placed onto the board, and when heated during reflow soldering, the solder cools and solidifies, creating secure electrical and mechanical connections. This design takes advantage of surface tension to perfectly align the chip during soldering, leading to better placement accuracy and stronger solder joints. The result is a more reliable connection, improved electrical performance, and a more compact board layout.

Our BGA Production Process: Built for Accuracy and Reliability

At Hi-Tek Electronics, we’ve refined our BGA production assembly process to deliver consistent, defect-free results—no matter how complex the project. Here’s how we build high-quality boards from start to finish:

• PCB Design Review
  Every project starts with a full review of your PCB design. We carefully check the layout, pad sizes, and solder mask to make sure they align with the BGA manufacturer’s specifications. Catching small issues early helps prevent problems like misalignment or poor solder joints down the line.
  
• Stencil Printing and Solder Paste Application
  We precisely apply solder paste onto the landing pads of the board PCB using advanced stencil printing techniques. This step ensures an even, controlled amount of solder at each connection point.
  
• Component Placement
  Our automated placement machines position each ball grid array package with pinpoint accuracy, ensuring every part is exactly where it should be.
  
• Reflow Soldering
  Boards then move through our temperature-controlled reflow ovens. The solder balls melt just enough to form strong, reliable bonds. As the solder cools and solidifies, surface tension naturally pulls each component into perfect alignment.
  
• Automated X-Ray Inspection (AXI)
  Because BGA connections are hidden underneath the package, we rely on automated X-ray inspection to verify solder joint quality. AXI allows us to catch hidden defects like voids, insufficient solder, or shorts that would otherwise go unseen.
  
• Electrical Testing
  Finally, we perform thorough electrical testing to confirm that every connection is clean, strong, and fully operational before your boards leave our facility.
  

This careful, proven manufacturing process ensures that every BGA build meets the highest standards for quality, reliability, and long-term performance—ready for real-world demands.

Types of BGA Packages We Support

Hi-Tek Electronics supports a wide variety of BGA styles to meet the diverse needs of modern industries. Plastic Ball Grid Arrays (PBGA) are one of the most common types we handle, offering a lightweight, cost-effective solution perfect for consumer electronics, telecommunications, and industrial devices. For projects that require extreme reliability—such as aerospace, military, or medical devices—we also support ceramic BGAs, which offer greater durability under harsh conditions.

In addition to standard packages, we specialize in fine pitch and micro BGA assemblies, enabling cutting-edge miniaturization for next-generation technology. Whether your project demands a plastic ball grid array for a smartphone-sized device or a rugged ceramic BGA for aerospace, Hi-Tek has the expertise, equipment, and team to deliver.stries—each with unique reliability requirements and form factor constraints.